Etch Rate

• Etch rate is the measure of how fast material is removed in the etch process.

• It is an important characteristic of the process, since it directly affects the throughput of the etch process.

• The etch rate can be calculated by measuring the film thickness before and after the etch process and dividing the thickness difference by the etch time.[3] [4]

Exercise: The thermal oxide film thickness is 5000°A. After 60 seconds of plasma etch the thickness becomes 2400°A. Calculate the etch rate.