·
Diffusion in SiO2
films is important as it is used as a mask to prevent diffusion of impurity
atoms in silicon
·
Group III and Group V
elements are glass formers in SiO2 and so lower the melting
temperatures of the oxide film.
·
As a general rule,
over the temperature used in VLSI, diffusivities of B, As, P and Sb are very
low when their concentrations are below that which causes the glass to melt.
·
Hydrogen, He, OH, Na,
O2 and Ga are fast diffusants in SiO2.
·
SIMS analysis is a
powerful tool for diffusion profile measurements. It can measure boron and
arsenic concentrations as low as 5X1015 atoms /cm3, and
has a high depth resolution of a few tens of angstroms. Therefore it is an
ideal tool for measuring shallow diffusion profiles.